[반도체 소자/공정/소재 최신 기술동향 세미나 안내 ] AMAT 4차세미나(7/25(화) 11:00)
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- 조회수2446
- 2023-07-11
[ 반도체 소자/공정/소재 최신 기술동향 세미나 안내 ] | |||
1. | 세미나주제 | : | Extending Moore’s Law with Advanced Packaging |
2. | 발 표 자 | : | 안진호 Account Technologist Director(Applied Materials) |
3. | 일 시 | : | 2023년 7월 25일(화), 11:00~ |
4. | 장 소 | : | 제 2공학관 26106호(오프라인진행) |
※ 첨부파일의 초록 및 약력을 참고 부탁드립니다. |
■ 발표제목: Extending Moore’s Law with Advanced Packaging
■ Speaker Bio: Jinho An has been serving as an Account Technologist Director in the Advanced Packaging Business Unit of Applied Materials Inc. since 2021. Before Applied, he worked for over 10 years as a process development engineer at Samsung’s Semiconductor R&D Center and Package Development Team working on advanced packaging technology including TSV and RDL process and product development. Jinho An has a B.S. in Inorganic Materials Engineering from Hanyang University and aPh.D. in Materials Science and Engineering from the University of Texas at Austin.